KEMET KONNEKT™ - More than just MORE CAP in LESS SPACE
What is KONNEKT™ Technology?
KONNEKT™ technology is a high-density packaging technology that allows components to be bonded together without the use of metal frames, reducing with it the ESR, ESL and thermal resistance to capacitors.
KONNEKT™ technology utilizes innovative transient liquid phase sintering (TLPS) material which has low temperature reaction of low melting point metal or alloy with a high melting point metal or alloy to form a reacted metal matrix. The result is a highly conductive bonding material that can be used to connect multiple MLCCs together to form a single surface mountable component.
KC-LINK™ with KONNEKT™ Technology
KEMET’s KC-LINK™ with KONNEKT™ technology surface mount capacitors are designed for high-efficiency and high-density power applications. KONNEKT high density packaging technology uses an innovative Transient Liquid Phase Sintering (TLPS) material to create a surface mount multi-chip solution for high density packaging. By utilizing KEMET’s robust and proprietary C0G base metal electrode (BME) dielectric system, these capacitors are well suited for power converters, inverters, snubbers, and resonators where high efficiency is a primary concern.
KONNEKT technology enables a low-loss, low-inductance package capable of handling extremely high ripple currents with no change in capacitance versus DC voltage and negligible change in capacitance versus temperature. With an operating temperature range up to 150°C, these capacitors can be mounted close to fast switching semiconductors in high power density applications, which require minimal cooling. KC-LINK with KONNEKT technology also exhibits high mechanical robustness compared to other dielectric technologies, allowing the capacitor to be mounted without the use of metal frames.
These capacitors can also be mounted in a low-loss orientation to further increase power handling capability. The low-loss orientation lowers ESR (Effective Series Resistance) and ESL (Effective Series Inductance) which increases ripple current handling capability.
U2J with KONNEKT™ Technology
By utilizing ultrastable U2J dielectric, KONNEKT™ enables a low-loss, low inductance package capable of handling extremely high ripple currents in the hundreds of kilohertz.
U2J is an extremely stable Class I dielectric material that exhibits a negligible shift in capacitance with respect to voltage and a predictable and linear change in capacitance with reference to ambient temperature, with minimal aging effect.
Capacitance change is limited to –750 ±120 ppm/°C from –55°C to +125°C. U2J KONNEKT™ can also be mounted in a low-loss orientation to further increasing its power handling capability. The low-loss orientation lowers ESR (Effective Series Resistance) and ESL (Effective Series Inductance) which increases ripple current handling capability.
X7R with KONNEKT™ Technology
KEMET’s X7R dielectric features a 125°C maximum operating temperature and is considered temperature stable.
The Electronics Components, Assemblies and Materials Association (EIA) characterizes X7R dielectric as a Class II material. Components of this classification are fixed, ceramic dielectric capacitors suited for bypass and decoupling applications or for frequency discriminating circuits where Q and stability of capacitance characteristics are not critical. X7R exhibits a predictable change in capacitance with respect to time and voltage, boasting a minimal change in capacitance with reference to ambient temperature. Capacitance change is limited to ±15% from −55°C to +125°C.
In addition to their use in power supplies, these capacitors can be used in industries related to automotive (hybrid), telecommunications, medical, military, aerospace, semiconductors and test/diagnostic equipment. Automotive Grade devices are also available which meet the demanding Automotive Electronics Council’s AEC-Q200 qualification requirements.