MicroPressure Evaluation Board Launch

Honeywell is pleased to announce the launch of the MicroPressure Evaluation Board, a new tool that is created to further simplify the way customers evaluate our MicroPressure offering. It is fully compatible to the Honeywell Sensor Evaluation Kit SEK002 and also compatible with the Arduino Uno, one of the most popular evaluation tools on the market today.

The MPR Evaluation Board is designed to offer plug and play functionality. Meaning that the board connects to the SEK002 via a series of jumpers (not included), and the SEK002 more quickly and easily attaches to the Arduino Uno. With the boards connected, the user is ready to begin evaluating. It’s that much easier. Minimalistic in size, the MPR Evaluation Board is more nimble and simpler to work with, allowing it to offer functionality beyond typical benchtop testing, and closer to the application.

The MPR Evaluation Board is available in four configurations, allowing designers to choose from a selection of pressure ranges and types to help get as close to their intended goal as possible.

Key Features

  • Plug and Play - Connect the MicroPressure evaluation board to the Honeywell SEK002 and mate to the Arduino Uno with more ease.
  • Platform Compatibility - Works in conjunction with the Arduino Uno, one of the most popular and easier to use evaluation platforms on the market today.
  • Beyond the Desk - mounted off the Arduino platform, the MicroPressure evaluation board offers users the ability to take their evaluations beyond their desk and closer to the application.
  • Small Package Design - Like the sensor it supports, the MicroPressure evaluation board is smaller and more nimble, making it easier and more flexible to work with.
  • Flexible Offering - Available in four configurations, the MicroPressure evaluation board offers a choice of various pressure ranges and communication protocols.

Launch Timeline

  • Internal and to Authorized Distributors: February 7th, 2019
  • Public: February 7th, 2019

Regions Affected

  • Asia Pacific (APAC)
  • Europe, Middle East, Africa (EMEA)
  • Greater China (GrGH)
  • Latin America (LATAM)
  • North America (NA)

Materials

The following materials have been developed: