| Series: | Mezzanine board-to-board |
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| Construction Form: | 0 |
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| Type : | Male |
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| Mounting Angle: | Angled |
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| No. Of Contacts: | 26 |
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| Operational Current: | 1.4 A at 20°C (50 pins) (IEC 60512-5-2) |
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| Pitch: | 1.27 mm |
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| Termination Technology: | SMT |
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| Temperature: | -55°C to +125°C |
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| Contact Material: | Copper alloy |
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| Plating: | Au over NiP over Ni |
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| Insulator Material: | LCP, UL 94 V-0 |
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| CTI value / IEC 60112: | 175 |
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| Mating Force: | 0.5 N per Pin |
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| Separating Force : | 0.1 N |
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| Mating Cycles: | Performance level 1: 500 |
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| Resistance: | <= 25 mOhm (IEC 60512-2-1) |
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| Clearance: | min. 0.4 mm |
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| Insulation Resistance: | >= 10 GOhm (IEC 60512-3-1) |
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| Test Voltage: | 500 VAC (IEC 60512-4-1) |
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| Soldering Temperature: | 20 - 40 s at 260°C (JEDEC J-STD-020E) |
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| Assembly Option: | Pick and Place |
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| Vibration: | 10 - 2000 Hz, 20g (IEC 60512-6-4) |
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| Shock: | 50g, 11 ms (IEC 60512-6-3) |
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