LEXI-R7 and SARA-R7 modules are optimized for low power and cost efficiency, enabling scalable cellular IoT deployments
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12 June 2026 Dubai, UAE: Trasna, a global technology leader specialising in cellular IoT modules and mobile IoT solutions, is proud to announce the introduction of its new LTE-M and NB-IoT cellular module series, powered by the Qualcomm® E51 4G Modem-RF chipset from Qualcomm Technologies, Inc.
This launch marks an important milestone, underscoring Trasna’s long-term commitment to the cellular IoT segment and provides strong continuity for customers and partners worldwide.
By the end of 2025, the mobile industry surpassed 1 billion active NB-IoT and LTE-M connections worldwide, marking a major milestone in the maturation of massive IoT and demonstrating the strong shift toward standardized, future-proof cellular LPWAN technologies. This trend is reflected in rapid adoption across metering, smart cities, industrial automation, logistics, and remote monitoring applications globally.
To address these growing demands, Trasna is launching the new LEXI-R7 and SARA-R7 modules, fully aligned with evolving market requirements.
This launch marks an important milestone, underscoring Trasna’s long-term commitment to the cellular IoT segment and provides strong continuity for customers and partners worldwide.
By the end of 2025, the mobile industry surpassed 1 billion active NB-IoT and LTE-M connections worldwide, marking a major milestone in the maturation of massive IoT and demonstrating the strong shift toward standardized, future-proof cellular LPWAN technologies. This trend is reflected in rapid adoption across metering, smart cities, industrial automation, logistics, and remote monitoring applications globally.
To address these growing demands, Trasna is launching the new LEXI-R7 and SARA-R7 modules, fully aligned with evolving market requirements.
As a connectivity enabler, Trasna R7 family comes with integrated SGP.32 compliance in the firmware, enabling access to IoT Remote SIM Provisioning (RSP) standards, including the option to integrate a fully SGP.32-compliant eSIM. This ensures the modules are truly future-proof, allowing customers to manage global connectivity profiles over the air under a “Bring Your Own Connectivity” model.
To ensure seamless hardware evolution for its partners, Trasna is introducing the new R7 LTE-M modules in both LEXI (16 × 16 × 2 mm) and SARA (16 × 26 × 2 mm) form factors.
The ultra-thin 2 mm profile, approximately 20% thinner than the market average, enables integration into highly space-constrained devices. The LEXI variant is among the smallest shielded modules available, offering robust interference protection in an ultra-compact footprint. The SARA variant provides a straightforward upgrade path, allowing customers to migrate existing IoT designs to the latest technology without costly or time-consuming PCB redesigns.
This new module series represents an evolutionary step toward 5G, with Trasna committed to introducing 3GPP Release 18 eRedCap modules in compatible form factors, enabling customers to design with R7 today and seamlessly reuse their development later for next-generation eRedCap solutions.
It is anticipated that product samples will be available this quarter, with volume production scheduled for Q4 2026.
Source: https://www.trasna.io/blog/r7-lte-m-nb-iot-modules
To ensure seamless hardware evolution for its partners, Trasna is introducing the new R7 LTE-M modules in both LEXI (16 × 16 × 2 mm) and SARA (16 × 26 × 2 mm) form factors.
The ultra-thin 2 mm profile, approximately 20% thinner than the market average, enables integration into highly space-constrained devices. The LEXI variant is among the smallest shielded modules available, offering robust interference protection in an ultra-compact footprint. The SARA variant provides a straightforward upgrade path, allowing customers to migrate existing IoT designs to the latest technology without costly or time-consuming PCB redesigns.
This new module series represents an evolutionary step toward 5G, with Trasna committed to introducing 3GPP Release 18 eRedCap modules in compatible form factors, enabling customers to design with R7 today and seamlessly reuse their development later for next-generation eRedCap solutions.
It is anticipated that product samples will be available this quarter, with volume production scheduled for Q4 2026.
Source: https://www.trasna.io/blog/r7-lte-m-nb-iot-modules