408-52200-100-12
EC.8 straight 200p
Manufacturer Item No.:
408-52200-100-12
Item number:
SE-65-4085220010012
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| Series: | HighSpeed edge card connections |
|---|---|
| Construction Form: | 0 |
| Type : | Direct Connector |
| Mounting Angle: | Straight |
| No. Of Contacts: | 200 |
| Operational Current: | 1.35 A at 20°C (140 of 140 pins), 3.20 A at 20°C (8 of 140 pins) (IEC 60512-5-2) |
| Pitch: | 0.8 mm |
| Termination Technology: | SMT |
| Temperature: | -55°C to +125°C |
| Contact Material: | Copper alloy |
| Datarate: | 28 Gbit/s |
| Plating: | Au over PdNi over Ni |
| Insulator Material: | LCP, UL 94 V-0 |
| CTI value / IEC 60112: | 200 |
| Mating Force: | 0.635 N per Pin |
| Separating Force : | 0.06 N |
| Mating Cycles: | 500 (IEC 60512-9-1) |
| Resistance: | <= 15 mOhm (IEC 60512-2-1) |
| Clearance: | 0.25 mm |
| Insulation Resistance: | >= 1 GOhm (IEC 60512-3-1) |
| Test Voltage: | 1100 VDC (IEC 60512-4-1) |
| Soldering Temperature: | 20 - 40 s at 260°C (JEDEC J-STD-020E) |
| Assembly Option: | Pick and Place |
| Termination area: | Sn over Ni |
| Vibration: | 10 - 2000 Hz, 20g (IEC 60512-6-4) |
| Shock: | 50g, 11 ms (IEC 60512-6-3) |
| Coding: | Yes |