| Series: | HighSpeed edge card connections |
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| Construction Form: | 0 |
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| Type : | Direct Connector |
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| Mounting Angle: | Straight |
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| No. Of Contacts: | 140 |
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| Operational Current: | 1.35 A at 20°C (140 of 140 pins), 3.20 A at 20°C (8 of 140 pins) (IEC 60512-5-2) |
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| Pitch: | 0.8 mm |
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| Termination Technology: | SMT |
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| Temperature: | -55°C to +125°C |
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| Contact Material: | Copper alloy |
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| Datarate: | 28 Gbit/s |
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| Plating: | Au over PdNi over Ni |
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| Insulator Material: | LCP, UL 94 V-0 |
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| CTI value / IEC 60112: | 200 |
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| Mating Force: | 0.635 N per Pin |
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| Separating Force : | 0.06 N |
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| Mating Cycles: | 500 (IEC 60512-9-1) |
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| Resistance: | <= 15 mOhm (IEC 60512-2-1) |
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| Clearance: | 0.25 mm |
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| Insulation Resistance: | >= 1 GOhm (IEC 60512-3-1) |
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| Test Voltage: | 1100 VDC (IEC 60512-4-1) |
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| Soldering Temperature: | 20 - 40 s at 260°C (JEDEC J-STD-020E) |
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| Assembly Option: | Pick and Place |
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| Termination area: | Sn over Ni |
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| Vibration: | 10 - 2000 Hz, 20g (IEC 60512-6-4) |
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| Shock: | 50g, 11 ms (IEC 60512-6-3) |
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| Coding: | Yes |
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