| Series: | Mezzanine board-to-board data transfer |
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| Construction Form: | 0 |
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| Type : | Plug |
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| Mounting Angle: | Straight |
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| No. Of Contacts: | 440 |
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| Operational Current: | max. 0.5 A |
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| Pitch: | 0.5 mm |
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| Termination Technology: | SMT |
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| Temperature: | -40°C to +125°C |
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| Connector Standard: | COM Express® |
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| Contact Material: | Copper alloy |
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| Datarate: | 10 Gbit/s |
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| Operational Voltage: | 50 VAC |
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| Plating: | Au over Ni |
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| Insulator Material: | LCP, UL 94 V-0 |
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| CTI value / IEC 60112: | 125 |
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| Mating Force: | max. 0.9 N per Pin |
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| Separating Force : | min. 0.1 N |
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| Mating Cycles: | 30 |
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| Resistance: | max. 75 mOhm |
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| Clearance: | 0.15 mm |
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| Insulation Resistance: | > 100 MOhm |
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| Test Voltage: | 200 VAC |
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| Board-to-Board Distance: | 8 mm |
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| Soldering Temperature: | 260°C nach J-STD-020 |
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| Assembly Option: | Pick and Place |
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